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Aries Electronics 7131-108-18

SOCKET ADAPT HB2E RELAY TO 8DIP

Manufacturer
Aries Electronics
Datasheet
Price
0.2
Stock
10000
Description
SOCKET ADAPT HB2E RELAY TO 8DIP

Product Details

Contact Finish - Post
Tin-Lead
Operating Temperature
-
Series
Correct-A-ChipĀ® 650000
Contact Finish - Mating
-
Features
-
Contact Material - Post
Brass
Part Status
Active
Termination Post Length
0.125" (3.18mm)
Termination
Solder
Convert To (Adapter End)
DIP, 0.6" (15.24mm) Row Spacing
Pitch - Post
0.100" (2.54mm)
Contact Material - Mating
-
Mounting Type
Through Hole
Convert From (Adapter End)
SOIC
Board Material
FR4 Epoxy Glass
Material Flammability Rating
-
Number of Pins
24
Contact Finish Thickness - Post
-
Pitch - Mating
0.050" (1.27mm)
Contact Finish Thickness - Mating
-
Dielectric Material
-