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Chip Quik, Inc. BARSN96.5AG3.0CU0.5

SOLDER BAR SN96.5/AG3.0/CU0.5 1L

Manufacturer
Chip Quik, Inc.
Datasheet
Price
74.17
Stock
99

Product Details

Inner Dimension
0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad
0.067" L x 0.067" W (1.70mm x 1.70mm)
Number of Positions
20
Type
QFN/LFCSP
Pitch
0.020" (0.50mm)
Series
Proto-Advantage IPC
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Part Status
Active