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Chip Quik, Inc. BARSN96.5AG3.0CU0.5-8OZ

SOLDER BAR SN96.5/AG3.0/CU0.5 8O

Manufacturer
Chip Quik, Inc.
Datasheet
Price
39.09
Stock
151

Product Details

Series
245
Storage/Refrigeration Temperature
50°F ~ 104°F (10°C ~ 40°C)
Weight
1 lb (453.59 g)
Process
Leaded
Diameter
0.031" (0.79mm)
Flux Type
No-Clean
Shelf Life
-
Wire Gauge
20 AWG, 22 SWG
Composition
Sn63Pb37 (63/37)
Part Status
Active
Melting Point
361°F (183°C)
Form
Spool, 1 lb (454 g)
Shipping Info
-
Type
Wire Solder
Shelf Life Start
-