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Chip Quik, Inc. SMDLTLFP500T5C
SOLDER PASTE LOW TEMP T5 500G
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 210
- Stock
- 0
Product Details
- Wire Gauge
- -
- Composition
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Part Status
- Active
- Melting Point
- 423 ~ 428°F (217 ~ 220°C)
- Shipping Info
- Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
- Form
- Jar, 17.64 oz (500g)
- Shelf Life Start
- Date of Manufacture
- Type
- Solder Paste
- Storage/Refrigeration Temperature
- 37°F ~ 46°F (3°C ~ 8°C)
- Series
- -
- Process
- Lead Free
- Diameter
- -
- Flux Type
- No-Clean
- Shelf Life
- 6 Months, 2 Months