Images are for reference only. See Product Specifications for product details

Chip Quik, Inc. TS391AX500C

THERMALLY STABLE SOLDER PASTE NO

Manufacturer
Chip Quik, Inc.
Datasheet
Price
97.5
Stock
100

Product Details

Shelf Life
-
Wire Gauge
-
Composition
Bi57Sn42Ag1 (57/42/1)
Part Status
Active
Melting Point
284°F (140°C)
Shelf Life Start
Date of Manufacture
Form
Tube
Storage/Refrigeration Temperature
-
Type
Solder Paste
Series
-
Process
Lead Free
Diameter
-
Flux Type
No-Clean