Images are for reference only. See Product Specifications for product details
Chip Quik, Inc. TS391LT500C
THERMALLY STABLE SOLDER PASTE NO
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 158.4
- Stock
- 7
Product Details
- Process
- Leaded
- Diameter
- 0.010" (0.25mm)
- Flux Type
- Rosin Mildly Activated (RMA)
- Shelf Life
- -
- Wire Gauge
- 30 AWG, 33 SWG
- Composition
- Sn63Pb37 (63/37)
- Part Status
- Active
- Melting Point
- 361°F (183°C)
- Shipping Info
- -
- Form
- Spool, 1 lb (454 g)
- Shelf Life Start
- -
- Type
- Wire Solder
- Storage/Refrigeration Temperature
- 50°F ~ 104°F (10°C ~ 40°C)
- Series
- 285