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Chip Quik, Inc. TS391SNL250
THERMALLY STABLE SOLDER PASTE NO
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 69.95
- Stock
- 13
Product Details
- Form
- Spool, 1 lb (454 g)
- Shipping Info
- -
- Type
- Wire Solder
- Shelf Life Start
- -
- Series
- 4901
- Storage/Refrigeration Temperature
- 65°F ~ 80°F (18°C ~ 27°C)
- Weight
- 1 lb (453.59 g)
- Process
- Lead Free
- Diameter
- 0.032" (0.81mm)
- Flux Type
- No-Clean
- Shelf Life
- -
- Wire Gauge
- 20 AWG, 21 SWG
- Composition
- Sn99.3Cu0.7 (99.3/0.7)
- Part Status
- Active
- Melting Point
- 442°F (227°C)