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Chip Quik, Inc. TS391SNL500C
THERMALLY STABLE SOLDER PASTE NO
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 128.25
- Stock
- 2
Product Details
- Type
- Wire Solder
- Series
- SMD
- Process
- Lead Free
- Diameter
- 0.040" (1.02mm)
- Flux Type
- No-Clean, Rosin Activated (RA)
- Shelf Life
- -
- Wire Gauge
- 18 AWG, 19 SWG
- Composition
- Sn42Bi57Ag1 (42/57/1)
- Part Status
- Active
- Melting Point
- 280°F (138°C)
- Shelf Life Start
- -
- Form
- Spool, 7 oz (200g)
- Storage/Refrigeration Temperature
- -