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Dialog Semiconductor GmbH SLG46826V

GPAK MIXED SIGNAL MATRIX

Manufacturer
Dialog Semiconductor GmbH
Datasheet
Price
0.2
Stock
10000
Description
GPAK MIXED SIGNAL MATRIX

Product Details

Clock Rate
-
On-Chip RAM
248kB
Part Status
Not For New Designs
Mounting Type
Surface Mount
Voltage - I/O
1.8V, 3.3V
Package / Case
529-BFBGA, FCBGA
Voltage - Core
1.05V, 1.20V
Base Part Number
TMS32DM6467
Type
Digital Media System-on-Chip (DMSoC)
Non-Volatile Memory
ROM (8 kB)
Series
TMS320DM646x, DaVinci™
Operating Temperature
-40°C ~ 105°C (TC)
Interface
EBI/EMI, Ethernet, HPI, I²C, McASP, PCI, SPI, UART, USB
Supplier Device Package
529-FCBGA (19x19)
Packaging
Tray