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Epson Electronics America Inc-Semiconductor Div S1C17W03F101100-250

16-BIT MCU 4.2MHZ16KB FLASH 2KB

Manufacturer
Epson Electronics America Inc-Semiconductor Div
Datasheet
Price
1.9
Stock
100

Product Details

Number of I/O
15
Core Processor
R8C
Speed
20MHz
Package / Case
20-LSSOP (0.173", 4.40mm Width)
Series
R8C/3x/32C
Data Converters
A/D 4x10b
RAM Size
512 x 8
Oscillator Type
Internal
Core Size
16-Bit
Base Part Number
R5F21321
Packaging
Tube
Program Memory Size
4KB (4K x 8)
EEPROM Size
-
Program Memory Type
FLASH
Part Status
Active
Operating Temperature
-40°C ~ 85°C (TA)
Peripherals
POR, PWM, Voltage Detect, WDT
Supplier Device Package
20-LSSOP
Connectivity
I²C, LINbus, SIO, SSU, UART/USART
Voltage - Supply (Vcc/Vdd)
1.8V ~ 5.5V
Mounting Type
Surface Mount