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Infineon Technologies IDC08S60CEX7SA1

DIODE GEN PURPOSE SAWN WAFER

Manufacturer
Infineon Technologies
Datasheet
Price
0.2
Stock
10000
Description
DIODE GEN PURPOSE SAWN WAFER

Product Details

Current - Reverse Leakage @ Vr
5pA @ 5V
Voltage - DC Reverse (Vr) (Max)
20V
Speed
Small Signal =< 200mA (Io), Any Speed
Current - Average Rectified (Io)
50mA (DC)
Series
-
Operating Temperature - Junction
-65°C ~ 125°C
Packaging
Tray
Voltage - Forward (Vf) (Max) @ If
1V @ 10mA
Diode Type
Standard
Part Status
Active
Mounting Type
Surface Mount
Package / Case
Die
Capacitance @ Vr, F
1.3pF @ 0V, 1MHz
Supplier Device Package
Die
Reverse Recovery Time (trr)
600ns