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Infineon Technologies SIDC23D60E6YX1SA1

DIODE GEN PURP 600V 50A WAFER

Manufacturer
Infineon Technologies
Datasheet
Price
0
Stock
100
Description
DIODE GEN PURP 600V 50A WAFER

Product Details

Part Status
Discontinued at Digi-Key
Mounting Type
Surface Mount
Package / Case
Die
Capacitance @ Vr, F
600pF @ 1V, 1MHz
Supplier Device Package
Sawn on foil
Reverse Recovery Time (trr)
0ns
Current - Reverse Leakage @ Vr
200µA @ 300V
Voltage - DC Reverse (Vr) (Max)
300V
Speed
No Recovery Time > 500mA (Io)
Current - Average Rectified (Io)
10A (DC)
Series
-
Operating Temperature - Junction
-55°C ~ 175°C
Packaging
Bulk
Voltage - Forward (Vf) (Max) @ If
1.7V @ 10A
Diode Type
Silicon Carbide Schottky