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Laird Technologies EMI 0493013400
RFI EMI GROUNDING MATERIAL
- Manufacturer
- Laird Technologies EMI
- Datasheet
- Price
- 0
- Stock
- 100
- Description
- RFI EMI GROUNDING MATERIAL
Product Details
- Shelf Life
- -
- Part Status
- Active
- Shelf Life Start
- -
- Attachment Method
- Rivet
- Type
- Fingerstock
- Plating - Thickness
- 299.21µin (7.60µm)
- Shape
- -
- Operating Temperature
- 121°C
- Width
- 0.620" (15.75mm)
- Storage/Refrigeration Temperature
- -
- Height
- 0.220" (5.59mm)
- Length
- 15.000" (381.00mm)
- Series
- Symmetrical (S3) Slotted
- Plating
- Tin
- Material
- Beryllium Copper