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Laird Technologies EMI 0C97043802
RFI EMI GROUNDING MATERIAL 25FT
- Manufacturer
- Laird Technologies EMI
- Datasheet
- Price
- 0.2
- Stock
- 10000
- Description
- RFI EMI GROUNDING MATERIAL 25FT
Product Details
- Attachment Method
- Adhesive
- Type
- Fingerstock
- Plating - Thickness
- -
- Shape
- -
- Operating Temperature
- 121°C
- Width
- 0.280" (7.11mm)
- Storage/Refrigeration Temperature
- -
- Height
- 0.110" (2.79mm)
- Length
- 16.000" (406.40mm)
- Series
- All-Purpose
- Plating
- Unplated
- Material
- Beryllium Copper
- Shelf Life
- -
- Part Status
- Active
- Shelf Life Start
- -