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Laird Technologies EMI 0C97055902

RFI EMI GROUNDING MATERIAL 25FT

Manufacturer
Laird Technologies EMI
Datasheet
Price
162.06
Stock
100
Description
RFI EMI GROUNDING MATERIAL 25FT

Product Details

Attachment Method
Adhesive
Type
Fingerstock
Plating - Thickness
-
Shape
-
Operating Temperature
121°C
Width
0.340" (8.64mm)
Storage/Refrigeration Temperature
-
Height
0.070" (1.78mm)
Length
24.000" (609.60mm)
Series
Twist
Plating
Unplated
Material
Beryllium Copper
Shelf Life
-
Part Status
Active
Shelf Life Start
-