Images are for reference only. See Product Specifications for product details
Laird Technologies EMI 67BCG2003201508R00
SP,CON,C,AU,TNR
- Manufacturer
- Laird Technologies EMI
- Datasheet
- Price
- 0.2
- Stock
- 10000
- Description
- SP,CON,C,AU,TNR
Product Details
- Material
- Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Shelf Life
- -
- Part Status
- Discontinued at Digi-Key
- Shelf Life Start
- -
- Attachment Method
- Solder
- Type
- Film Over Foam
- Plating - Thickness
- -
- Shape
- Rectangle
- Operating Temperature
- -40°C ~ 70°C
- Width
- 0.197" (5.00mm)
- Storage/Refrigeration Temperature
- -
- Height
- 0.197" (5.00mm)
- Length
- 0.118" (3.00mm)
- Series
- -
- Plating
- -