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Laird Technologies EMI BMI-C-006
CONTACT BECU 2.9X1.5MM
- Manufacturer
- Laird Technologies EMI
- Datasheet
- Price
- 0
- Stock
- 6114
Product Details
- Shelf Life Start
- -
- Attachment Method
- Solder
- Type
- Film Over Foam
- Plating - Thickness
- -
- Shape
- Rectangle
- Operating Temperature
- -40°C ~ 70°C
- Width
- 0.157" (4.00mm)
- Storage/Refrigeration Temperature
- -
- Height
- 0.138" (3.50mm)
- Length
- 0.118" (3.00mm)
- Series
- SMD Grounding Metallized
- Plating
- -
- Material
- Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Shelf Life
- -
- Part Status
- Active