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Microsemi Corporation WIN827NHEI-260A1

WP2 827 260 MHZ,LF BALLS,PBF BUM

Manufacturer
Microsemi Corporation
Datasheet
Price
0.2
Stock
10000
Description
WP2 827 260 MHZ,LF BALLS,PBF BUM

Product Details

Part Status
Active
Applications
Network Processor
Mounting Type
Surface Mount
Core Processor
MIPS32® 34Kc™
Package / Case
896-BGA, FCBGA
Voltage - Supply
-
Controller Series
-
Program Memory Type
SRAM
Operating Temperature
-
Series
-
Supplier Device Package
896-FCBGA (31x31)
RAM Size
-
Interface
I²C, RMII, UART