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Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39152B4112Z610W3
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- Manufacturer
- Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
- Datasheet
- Price
- 0
- Stock
- 100
Product Details
- Packaging
- Bulk
- Part Status
- Obsolete
- Height (Max)
- 0.059" (1.50mm)
- Mounting Type
- Surface Mount
- Package / Case
- 8-SMD, No Lead
- Size / Dimension
- 0.150" L x 0.150" W (3.80mm x 3.80mm)
- Series
- *