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Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39871R804H210

SAW RES 868.3500MHZ SMD

Manufacturer
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Datasheet
Price
0
Stock
0

Product Details

Mounting Type
Through Hole
Package / Case
Radial - 2 Leads
Size / Dimension
0.236" L x 0.157" W (6.00mm x 4.00mm)
Frequency Stability
±0.3%
Type
Ceramic
Frequency Tolerance
±0.5%
Height
0.276" (7.00mm)
Operating Temperature
-40°C ~ 85°C
Series
FCR
Features
-
Frequency
16MHz
Impedance
40 Ohms
Packaging
Cut Tape (CT)
Part Status
Obsolete