Renesas Electronics America M30855FJGP#U3

Product Details

Packaging

Tray

Program Memory Size

2MB (2M x 8)

EEPROM Size

-

Program Memory Type

FLASH

Part Status

Not For New Designs

Operating Temperature

-40°C ~ 125°C (TA)

Peripherals

DMA, POR

Supplier Device Package

144-LQFP (20x20)

Connectivity

CANbus, LINbus, SCI, SPI, UART/USART

Voltage - Supply (Vcc/Vdd)

1.35V ~ 1.65V

Mounting Type

Surface Mount

Number of I/O

68

Core Processor

ARM® Cortex®-R4F

Speed

140MHz

Package / Case

144-LQFP

Series

Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R

Data Converters

A/D 20x12b

RAM Size

160K x 8

Oscillator Type

External

Core Size

16/32-Bit

Base Part Number

TMS570LS20216