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Samsung Semiconductor, Inc. SPHWHAHDNG2VYZVVD2
HIGH POWER LED SERIES CHIP ON BO
- Manufacturer
- Samsung Semiconductor, Inc.
- Datasheet
- Price
- 0.2
- Stock
- 10000
- Description
- HIGH POWER LED SERIES CHIP ON BO
Product Details
- Height
- 1.37mm
- Size / Dimension
- 18.50mm L x 15.00mm W
- Series
- CXM-11
- Temperature - Test
- 85°C
- CCT (K)
- 2700K 2-Step MacAdam Ellipse
- CRI (Color Rendering Index)
- 80
- Features
- -
- Light Emitting Surface (LES)
- 10.80mm Dia
- Lens Type
- Flat
- Lumens/Watt @ Current - Test
- 109 lm/W
- Packaging
- Tray
- Voltage - Forward (Vf) (Typ)
- 35V
- Wavelength
- -
- Flux @ Current/Temperature - Test
- 1225lm (Typ)
- Part Status
- Active
- Configuration
- Rectangle
- Current - Max
- 640mA
- Type
- Chip On Board (COB)
- Viewing Angle
- 120°
- Color
- White, Warm
- Current - Test
- 320mA