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Samtec, Inc. HSEC8-125-01-S-DV-A-K-TR
.8MM HIGH SPEED DUAL VERTICAL MO
- Manufacturer
- Samtec, Inc.
- Datasheet
- Price
- 0
- Stock
- 262
- Description
- .8MM HIGH SPEED DUAL VERTICAL MO
Product Details
- Series
- HPCE®
- Number of Rows
- 2
- Features
- Board Guide, Locking Ramp
- Contact Material
- Copper Alloy
- Read Out
- Dual
- Number of Positions
- 280
- Card Type
- PCI Express™
- Material - Insulation
- Polyamide (PA), Nylon, Glass Filled
- Packaging
- Tray
- Operating Temperature
- -55°C ~ 85°C
- Part Status
- Active
- Contact Finish Thickness
- 30.0µin (0.76µm)
- Termination
- Solder, Staggered
- Number of Positions/Bay/Row
- 11; 38; 91
- Contact Type
- Cantilever
- Mounting Type
- Through Hole
- Color
- Black
- Card Thickness
- 0.062" (1.57mm)
- Pitch
- 0.039" (1.00mm)
- Contact Finish
- Gold
- Gender
- Female
- Flange Feature
- -