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Winbond Electronics W25Q256FVCIP

IC FLASH 256M SPI 24TFBGA

Manufacturer
Winbond Electronics
Datasheet
Price
0.2
Stock
10000
Description
IC FLASH 256M SPI 24TFBGA

Product Details

Memory Interface
SPI - Quad I/O
Series
-
Voltage - Supply
2.7V ~ 3.6V
Packaging
Tray
Operating Temperature
-40°C ~ 85°C (TA)
Technology
FLASH - NAND (SLC)
Supplier Device Package
16-SOP
Access Time
155µs
Write Cycle Time - Word, Page
-
Memory Size
1Gb (128M x 8)
Memory Type
Non-Volatile
Part Status
Active
Memory Format
FLASH
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.295", 7.50mm Width)
Clock Frequency
104MHz