Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Laird Technologies - Thermal Materials A14855-02

THERMAL GREASE 1KG TGREASE 1500

0.2

t-Global Technology TG-NSP35-5LB

THERMAL NON-SILICONE PUTTY 5LB

0.2

Leader Tech Inc. TGZ30-300

300CC

0.2

Laird Technologies - Thermal Materials A14259-05

TGREASE 2500 0.5 KG

0.2

Laird Technologies - Thermal Materials A16001-01

TPCM 780SP 1/2KG CAN 1PINT

0.2

Wakefield-Vette 126-5LB

NONSILICONE GREASE 5LB CAN

0.2

Aavid, Thermal Division of Boyd Corporation 100800F00000G

THERMAL PASTE

0.2

Aavid, Thermal Division of Boyd Corporation 101600F00000G

THERMAL PASTE

0.2