Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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MG Chemicals 8329TCS-50ML

EPOXY

0.2

MG Chemicals 8329TCM-50ML

EPOXY

0.2

Wakefield-Vette BT-402-H

THERMALLY CONDUCTIVE EPOXY POTTI

0.2

Laird Technologies - Thermal Materials A16858-07

TFLEX CR200 8 MIL 50CC CARTRIDGE

0.2

Laird Technologies - Thermal Materials A16858-09

TFLEX CR200 10 MIL 50CC CARTRIDG

0.2

Laird Technologies - Thermal Materials A16241-03

THERMAL GREASE 30CC TGREASE 880

0.2

Laird Technologies - Thermal Materials A16858-01

TFLEX CR200 50CC CARTRIDGE

0.2

LOCTITE 230178

7387 THERMAL ADHESIVE ACTIVATOR

0.2