Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Littelfuse Inc. P0200-20

COMPOUND HEAT SINK 2OZ JAR

0.2

Laird Technologies - Thermal Materials A10548-08

TPUTTY 502 25CC

0.2

Aavid, Thermal Division of Boyd Corporation 100100F00000G

THERMAL PASTE

0.2

Laird Technologies - Thermal Materials A16241-02

THERMAL GREASE 30CC TGREASE 2500

0.2

Laird Technologies - Thermal Materials A16241-01

THERMAL GREASE 30CC TGREASE 1500

0.2

LOCTITE 1401008

2151 THERMALLY CONDUCTIVE ADH

0.2

Wakefield-Vette BT-302-50M

FAST CURING ALUMINUM FILLED BOND

0.2

Aavid, Thermal Division of Boyd Corporation 100000F00000G

THERMAL PASTE

0.2