Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Chip Quik, Inc. TC1-20G

HEAT SINK COMPOUND - HIGH DENSIT

12.95

Wakefield-Vette BT-102-50M

TOUGHENED, FLEXIBLE ADHESIVE SYS

12.22

t-Global Technology S606-ULR-1OZ

S606-ULR 1OZ CONTAINER

11.77

Bergquist GF3500S35-00-60-400CC

LIQUID GAP FILLER THERMAL CONDUC

248.27

Parker Chomerics 65-02-GEL30-0180

THERM-A-GAP GEL30 180CC

145.55

Laird Technologies - Thermal Materials A17170-02

TPUTTY 508

97.71

Laird Technologies - Thermal Materials A17251-01

TPUTTY 607 75CC EFD CARTRIDGE

68.67

Wakefield-Vette BT-301-50M-EQZ

TWO DUAL CATRIDGES (BT-301-50M),

65.45