Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Bergquist GF4000-00-240-50CC

GAP FILLER 4000 50CC CARTRIDGE

54.1

Bergquist GF3500LV-00-240-50CC

GAP FILLER 3500LV 50CC CARTRIDGE

54.1

Bergquist GF3500S35-07-60-50CC

LIQUID GAP FILLER THERMAL CONDU

54.1

Bergquist GF3500S35-00-60-50CC

GF3500S35 50CC DUAL CARTRIDGE

47.05

Parker Chomerics 65-02-TC50-0030

THERM-A-GAP TC50 5.2W/M-K 30CC

40.97

Bergquist GF1500LV-00-120-50CC

GAP FILLER 1500LV 50CC CARTRIDGE

31.88

Bergquist GF1500-00-60-50CC

GF1500 50CC DUAL CARTRIDGE

31.88

Bergquist GF1000-00-15-50CC

GF1000 50CC DUAL CARTRIDGE

31.88