Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Parker Chomerics 65-02-TC50-0180

THERM-A-GAP TC50 5.2W/M-K 180CC

148.93

Wakefield-Vette 120-80

SILICONE GREASE 5 LBS CAN

138.05

LOCTITE 234476

3873 SELF SHIM HI COND THERM ADH

48.86

LOCTITE 1586134

ECCOBOND 56C-CAT 9 KIT, 140.5GM

873.86

Chemtronics CW7100

CONDUCTIVE SILVER GREASE SYRINGE

48.53

Parker Chomerics 65-02-GEL30-0030

THERM-A-GAP GEL30 3.5W/M-K 30CC

43.89

Parker Chomerics 65-00-GEL30-0010

THERM-A-GAP GEL30 3.5W/M-K 10CC

32.71

Aavid, Thermal Division of Boyd Corporation 100200F00000G

THER-O-LINK PASTE TUBE 2OZ

22.17