Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Carlo Gavazzi Inc. HTS02S

SILICONE HEATSINK PASTE 2ML

14.17

Wakefield-Vette BT-101-50M

NON-SAG 5 MINUTE BONDATHERM EPOX

12.22

t-Global Technology S606N-30

NON SILICONE THERMAL GREASE 30G

10.64

Chip Quik, Inc. TC1-10G

HEAT SINK COMPOUND - HIGH DENSIT

8.95

Parker Chomerics 65-00-GEL30-0300

THERM-A-GAP GEL30 300CC

270.56

t-Global Technology S606C-1000

SILICONE THERMAL GREASE 1KG

232.95

Parker Chomerics 65-00-CIP35-0200

THERM-A-FORM CIP35 POTTING 200CC

154.37

Parker Chomerics 65-00-TC50-0300

THERM-A-GAP TC50 5.2W/M-K 300CC

273.9