Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Taica North America Corporation DP-200-30

THERMAL PASTE, 30CC SYRINGE

74.88

Aavid, Thermal Division of Boyd Corporation 4952G

THERMALBOND EPOXY 7OZ PACKET

55.38

Wakefield-Vette GL-08-10

ULTIMIFLUX GEL 10CC SYRINGE 2.4W

50.72

Wakefield-Vette BT-403-H

ALUMINUM FILLED BONDATHERM EPOXY

43.1

Chip Quik, Inc. TC2-20G

HEAT SINK COMPOUND - GREY ULTRA

40.95

Aavid, Thermal Division of Boyd Corporation 4949G

THERMALBOND EPOXY 0.875OZ PACKET

37.11

Wakefield-Vette BT-301-200M

FAST CURING THERMALLY CONDUCTIVE

37.1

t-Global Technology TGPK27B

PHASE CHANGE STICK BLUE 27G

27.81