Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

---

t-Global Technology TGPK27P

PHASE CHANGE STICK PINK 27G

27.81

Bergquist TIC1000A-00-00-5CC

TIC 1000A 5CC TUBE

24.83

Wakefield-Vette BT-103-50M

5 MINUTE CLEAR BONDATHERM EPOXY

12.22

t-Global Technology S606N-1000

NON SILICONE THERMAL GREASE 1KG

253.66

t-Global Technology TG-NSP-60 1LB

NON-SILICONE PUTTY 6 W/MK 1LB

227.34

Laird Technologies - Thermal Materials A17170-03

TPUTTY 508 360CC EFD CARTRIDGE

186.08

Wakefield-Vette BT-102-50M-EQZ

TWO DUAL CATRIDGES (BT-102-50M),

65.45

Laird Technologies - Thermal Materials A17251-03

TPUTTY 607 360CC EFD CARTRIDGE

256.67