Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Parker Chomerics 65-00-T630-0300

THERM-A-GAP T630 0.7W/M-K 300CC

167.04

t-Global Technology TG-NSP-60 4OZ

NON-SILICONE PUTTY 6 W/MK 4OZ

141.12

Taica North America Corporation DP-100-30

THERMAL PASTE, 30CC SYRINGE

111.74

Laird Technologies - Thermal Materials A16872-03

TPUTTY 403 180CC CARTRIDGE

85.95

t-Global Technology TG-NSP25-60

SILICONE FREE THERMAL PUTTY 60CC

77.91

Techspray 1978-1

SILICONE FREE HEAT SINK

72.11

Aavid, Thermal Division of Boyd Corporation 4951G

THERMALBOND EPOXY 3.5OZ PACKET

66

Wakefield-Vette BT-101-50M-EQZ

TWO DUAL CATRIDGES (BT-101-50M),

65.45