Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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Parker Chomerics 65-02-T630-0030

THERM-A-GAP T630 0.7W/M-K 30CC

60.98

Wakefield-Vette GL-60-10

ULTIMIFLUX GEL 10CC SYRINGE 3W/M

59.39

MG Chemicals 8329TFM-50ML

MEDIUM CURE THERM COND ADH FLOW

38.83

MG Chemicals 8329TFS-50ML

SLOW CURE THERM COND ADH FLOW

38.83

MG Chemicals 8463-7G

GREASE SILVER CONDUCTIVE 0.25OZ

36.38

Techspray 1978-DP

SILICONE FREE HEAT SINK COMP.

32.95

Aavid, Thermal Division of Boyd Corporation 251G

THERMALCOTE GREASE CAN 1LB

28.58

MG Chemicals 8616-85ML

SUPER THERMAL GREASE

28.51