Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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3M 2035-2.5KG

THERMALLY CONDUCTIVE GREASE 2.5

8387.94

Bergquist TIC4000-00-00-200CC

TIC 4000 200CC CARTRIDGE

6380.21

Laird Technologies - Thermal Materials A16411-20

TPUTTY 506 20 KG 5 GAL PAIL

4950.23

Laird Technologies - Thermal Materials A16858-05

TFLEX CR200 10 MILS 40 KG 5GAL P

4138.5

Laird Technologies - Thermal Materials A16858-04

TFLEX CR200 8 MILS 40 KG 5GAL PA

4017.96

Laird Technologies - Thermal Materials A16858-03

TFLEX CR200 40 KG 5GAL PAILS

4002.47

Laird Technologies - Thermal Materials A14259-04

THERMAL GREASE 1GAL TGREASE 2500

2859.62

Laird Technologies - Thermal Materials A16872-01

TPUTTY 403 20 KG 5 GAL PAIL

2707.19