Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.


Laird Technologies - Thermal Materials A15685-00

TPUTTY 504 170CC CARTRIDGE

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Laird Technologies - Thermal Materials A13717-01

TPUTTY 504 10CC SYRINGE MANUAL

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Laird Technologies - Thermal Materials A13717-02

TPUTTY 504 10CC SYRINGE AUTOMATI

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Laird Technologies - Thermal Materials A15669-01

TPUTTY 504 100CC CARTRIDGE

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Laird Technologies - Thermal Materials A13926-04

TPUTTY 504 100CC PAIL

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Laird Technologies - Thermal Materials A13926-02

TPUTTY 504 1000CC PAIL

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LOCTITE 1704238

LOCTITE NSWC 100 THERMAL GREASE

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t-Global Technology S606C-30

SILICONE THERMAL GREASE 30G JAR

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