Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

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t-Global Technology S606B-50

SILICONE THERMAL GREASE 50G JAR

0.2

t-Global Technology S606-30

SILICONE THERMAL GREASE 30G JAR

0.2

LOCTITE 852815

THERMSTRATE 1000 TC 1.75 X 1.25

0.2

Laird Technologies - Thermal Materials A13717-03

TPUTTY 504 30CC SYRINGE

0.2

MG Chemicals 8610-60G

HEAT TRANS COMPOUND NON-SILICONE

0.2

3M TC2810 37ML

THERM COND ADH TC-2810 37 ML

0.2

GC Electronics 10-8120

GREASE HTSINK TYP44 NONSIL 1.0OZ

0.2

Laird Technologies - Thermal Materials A16001-02

TPCM 780SP 20KG 5GAL PAIL

0.2