Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.

---

LOCTITE 1188036

CATALYST 23LV CLR 8LB 3.63KG

197.84

3M 2035-0.5KG

THERMALLY CONDUCTIVE GREASE .5

0

Laird Technologies - Thermal Materials A13717-05

TPUTTY 504 55CC SYRINGE MANUAL

0

Laird Technologies - Thermal Materials A13926-01

TPUTTY 504 400CC PAIL

0

Laird Technologies - Thermal Materials A13926-03

TPUTTY 504 3KG PAIL

0

Laird Technologies - Thermal Materials A13717-04

TPUTTY 504 30CC SYRINGE AUTOMATI

0

Laird Technologies - Thermal Materials A15638-01

TPUTTY 504 305CC CARTRIDGE

0

Laird Technologies - Thermal Materials A15731-01

TPUTTY 504 20 KG BUCKET

0